【Taiwan Intel】JR0149511 Electronic Package Engineering Graduate Internship (Open)
修改時間:2020年11月20日 09:11
We have new intern opening at Intel Taiwan, the position details below & students can also review this position at career websites www.intel.com/jobs ( search for requisition number JR0149511)
Job Description
The Intel Optane Group (IOG) Taiwan is looking for a paid intern to help support packaging research and development projects. This position will involve working with assembly subcon team, Intel packaging team, planning, SMT, and electrical test groups.
Qualifications
Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.
- The candidate must be pursuing a Master or PHD degree in Materials Science, Chemical Engineering, Mechanical Engineering, Metallurgical Engineering, or related field.
- The candidate must have the unrestricted right to work in the Taiwan without requiring sponsorship.
Working location : Taiwan Hsinchu